Pdf To Dsn Converter Weight Google

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Standard cylinders DSNU/DSNUP/DSN/ESNU/ESN, ISO 6432 Key features At a glance ISO 6432 DIN ISO 6432 DIN Round cylinders with piston diameters from 8 to 25 mm con­ form to ISO 6432, DIN ISO 6432. Variants are based on these standards The series is not repairable Stainless steel piston rod The cap is roller burnished onto the barrel Wide choice.

US9818905B2 - Integrated circuit and manufacturing method - Google Patents US9818905B2 - Integrated circuit and manufacturing method - Google Patents Integrated circuit and manufacturing method Info Publication number US9818905B2 US9818905B2 US14/883,503 US03A US9818905B2 US 9818905 B2 US9818905 B2 US 9818905B2 US 03 A US03 A US 03A US 9818905 B2 US9818905 B2 US 9818905B2 Authority US United States Prior art keywords layer sensor gas further forming Prior art date 2013-01-07 Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.) Active, expires 2034-01-26 Application number US14/883,503 Other versions Inventor Aurelie Humbert Roel Daamen Youri Victorovitch Ponomarev Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.) NXP BV Original Assignee NXP BV Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.) 2013-01-07 Filing date 2015-10-14 Publication date 2017--01-07 Priority to EP13150418.5A priority Critical patent/EP2752660B1/en 2013-01-07 Priority to EP13150418 priority 2013-01-07 Priority to EP13150418.5 priority 2014-01-03 Priority to US14/147,214 priority patent/US9188540B2/en 2015-10-14 Application filed by NXP BV filed Critical NXP BV 2015-10-14 Priority to US14/883,503 priority patent/US9818905B2/en 2015-10-21 Assigned to NXP B.V. Reassignment NXP B.V. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Proposed circuit comprises input interface (5) to receive power from power source (6) and output interface (11) to feed preset electric power to load (4), and multiple capacitors (2), multiple control thermistors and multiple switches (3), each being connected to appropriate capacitor (2). Simistornij regulator napryazheniya dlya induktivnoj nagruzki. Each switch (3) is wired to switch from 1 st operating state, whereat it closes the circuit connecting load (4), appropriate capacitor (2) and power supply circuit (6) to 2 nd operating state whereat it does not close aforesaid circuit.

Disclosed is an integrated circuit comprising a substrate ( 10); and an optical CO 2 sensor comprising: first and second light sensors ( 12, 12′) on said substrate, said second light sensor being spatially separated from the first light sensor; and a layer portion ( 14) including an organic compound comprising at least one amine or amidine functional group over the first light sensor; wherein said integrated circuit further comprises a signal processor ( 16) coupled to the first and second light sensor for determining a difference in the respective outputs of the first and second light sensor. An electronic device comprising such a sensor and a method of manufacturing such an IC are also disclosed. FIELD OF THE INVENTION The present invention relates to an integrated circuit (IC) comprising a CO 2 sensor. The present invention further relates to a method of manufacturing such an IC.

Pdf To Dsn Converter Weight Google

BACKGROUND OF THE INVENTION Nowadays, integrated circuits (ICs) may comprise a plethora of sensors, such as gas sensors, relative humidity (RH) sensors, specific analyte detection sensors, and so on. Such sensors may be included in the IC design for a number of reasons. For instance, a gas sensor may be included in an IC to detect a change in the ambient conditions of a product tagged with the chip such that product quality control can be achieved by monitoring the sensor readings of the chip. This can for instance be used to accurately predict the remaining shelf life of the product, e.g. Perishable food stuff.

The gas sensor may for instance be adapted to determine changes in the CO 2 content of the ambient atmosphere. Alternatively, the gas sensor may be used to detect changes in the gas composition of larger environment such as buildings or may be used in medical application domains, e.g. In breathing apparatuses.

With the ongoing diversification of electronic devices or electronic information gathering such as by RF tags on packaged articles, it is often desirable to include different types of sensors in a single IC. For instance, the detection of other environmental parameters, for instance temperature and humidity such as for HVAC (heating, ventilation and air conditioning) control in buildings and cars, are particularly desirable in certain application domains. In addition, sensing of analytes of interest, e.g. CO 2, may be desirable in such application domains. However, it is difficult to manufacture CO 2 sensors having the desired sensitivity in a cost-effective manner.